CGA4J1X7R2A225KT0Y0N 代理TDK
-
尺寸
长度(L) |
- 2.00mm +0.25,-0.15mm
|
宽度(W) |
- 1.25mm +0.25,-0.15mm
|
厚度(T) |
- 1.25mm +0.25,-0.15mm
|
端子宽度(B) |
- 0.20mm Min.
|
端子间隔(G) |
- 0.50mm Min.
|
推荐焊盘布局(PA) |
- 1.00mm to 1.30mm(Flow Soldering)
0.90mm to 1.20mm(Reflow Soldering)
|
推荐焊盘布局(PB) |
- 1.00mm to 1.20mm(Flow Soldering)
0.70mm to 0.90mm(Reflow Soldering)
|
推荐焊盘布局(PC) |
- 0.80mm to 1.10mm(Flow Soldering)
0.90mm to 1.20mm(Reflow Soldering)
|
电气特性
电容 |
- 2.2μF ±10%
|
额定电压 |
- 100VDC
|
温度特性  |
- X7R(±15%)
|
耗散因数 (Max.) |
- 5%
|
绝缘电阻 (Min.) |
- 45MΩ
|
其他
温度范围 |
- -55~125°C
|
焊接方法 |
- 流体
- 回流
|
AEC-Q200 |
- YES
|
包装形式 |
- 塑封编带 (180mm卷筒)
|
包装个数 |
- 2000pcs
|
